ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,512, issued on Sept. 8, was assigned to Allegro MicroSystem LLC (Manchester, N.H.). "Packaged current sensor integrated circuit" was invent... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,513, issued on Sept. 8, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Jump-fusing and tailored PCB system for loop inductance reduction... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,514, issued on Sept. 8, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device and method of manufacturing semiconductor ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,515, issued on Sept. 8, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy). "Method of manufacturing semiconductor devices a... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,516, issued on Sept. 8, was assigned to STMICROELECTRONICS PTE LTD (Singapore). "Semiconductor package with exposed electrical contacts" wa... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,517, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.). "Packaging architecture with patterned through-dielectric vias a... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,518, issued on Sept. 8, was assigned to DAEDUCK ELECTRONICS Co. LTD. (Gyeonggi-Do, South Korea). "Circuit board and manufacturing method th... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,519, issued on Sept. 8, was assigned to Qorvo US Inc. (Greensboro, N.C.). "Multichip module thermal management through backside metal" was ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,520, issued on Sept. 8, was assigned to DENSO Corp. (Kariya-city, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp. ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,521, issued on Sept. 8, was assigned to STMicroelectronics (Grenoble 2) SAS (Grenoble, France). "Electronic device with thermally coupled c... Read More